Micro abrasion technology finds application in many specialist areas - especially those of dentistry, electronics, metalworking, conservation and etch working. For example, micro-abrasive dentistry is a conservative, less traumatic alternative to a high-speed drill, which allows doctors to selectively remove decay leaving more healthy tooth structure intact. Since the procedure is less invasive to healthy tooth structure, the air abrasion process can be accomplished in less time, and often without the need for anaesthesia.

This well established process utilises a micro-fine jet of abrasive particles as an abrading tool for drilling micron level holes, for cutting or for marking fragile or otherwise difficult materials.

Equipment from PESL runs from bench top to stand-alone programmable automatics used in electronics manufacture.

For example, the Crystal-Mark SWAM C wafer contouring system edge contours and cuts rounds and flats of semi-conductor wafers.

The abrasive process virtually eliminates all micro cracking and fracturing of the wafer and provides dimensional tolerances of better than ±0.002u.

Micro abrasive equipment from Crystal-Mark, Texas Airsonics and SS White is also available from PESL.

All have selectable performance dependent upon the operation required.

Adjustment of abrasive particulate size, speed and volume flow, coupled with varying nozzle diameter, ensures that these machines are sophisticated process tools.

Nozzle sizes down to 0.003n and abrasive powders down to 5 microns offer precision capability.

The process itself is one of variable pneumatic projection of a fine stream of abrasive powder, and it is this precision tool which can be used for marking and/or removal of component marks, removal of conformal coatings, cleaning, wafer fabrication, precision deburring, polishing, micro hole drilling, adjusting resistors and capacitors, preparing ceramic plates, creating conductive paths.

There are also wide applications for metalworking, grinding, deburring, glass and plastics, marking and for anything from cutting optical fibres to adjusting internal mould surfaces or engraving fragile items.